Industrial system with Intel® H310 Chipset, support for Intel® 9th/8th Gen Processors and Discrete GFX card
  • System Size : 224W x 368D x 166.3H(mm) - Discrete GFX card support (Optional)
  • Support Intel® 9th/8th Gen Processor
  • Dual Channel DDR4, 2 x SO-DIMMs
  • DVI-D, VGA & DP ports for multiple display
  • 4 x GbE LAN Ports
  • 4 x COM Ports
  • 8 x USB Ports
  • Factory Automation
  • Transportation
  • Embedded & Industrial Applications
  • Machine Vision

Dimension 224W x 368D x 166.3H(mm) - Discrete GFX max 250W support (Optional)
CPU Support for 9th/8th Generation
Intel® Core™ i7/i5/i3, Pentium® and Celeron® processors in the LGA1151 package
TDP under 65W
Chipset Intel® H310 Express Chipset
Memory 2 x DDR4 SO-DIMM sockets, Max. Capacity 32 GB
Support Dual channel DDR4 2666/2400 MHz memory modules
Ethernet 1 x GbE LAN Port (Intel® I219V)
3 x GbE LAN Ports (Intel® I211AT)
Graphic Support Integrated Graphics Processor - Intel® HD Graphics support:
1 x DP port, supporting a maximum resolution of 4096x2160 @30Hz
1 x DVI-D port, supporting a maximum resolution of 1920x1080 @60Hz
1 x VGA port, supporting a maximum resolution of 1920x1200 @60Hz

(2 independent display outputs)
Audio Realtek® Audio Codec
Storage 3 x 2.5" HDD/SSD (SATA 6Gb/s)
Expansion Slots 1 x 2280 M.2 M-Key (SATA 6Gb/s)
1 x 2230 M.2 E-Key (WiFi/BT)
1 x Full-size Mini PCIe with SIM slot (PCIe x1 + USB2.0) -- support 3G/4G module
1 x PCIe slot -- Discrete riser card support
Front I/O 1 x Power Switch/Power/HDD LED
3 x Audio Jacks (Line in, Line out, Mic in)
1 x Display port
1 x DVI-D
1 x VGA
2 x COM Ports (RS-232/422/485 & RI/5V/12V)
2 x COM Ports (RS-232)
4 x RJ45 LAN Ports
4 x USB 3.2 Gen 1
4 x USB 2.0
1 x 4-pin Terminal Block
2 x External Antenna Holes (Optional)
Rear I/O
Riser card (Optional) PCIe x4 (Gen3 x1)
PCIe x16 (Gen3 x16) -- Discrete GFX card: max. 250W, max length 293mm
Power +24V~48VDC (Full Range) -- Support discrete GFX card
Operation Temperature For Main system :
Operating temperature: -20°C to 50°C (CPU TDP 65W)
Operating temperature: -20°C to 60°C (CPU TDP 35W)

For Full system :
Depends on the Graphic cards installed in the system

Operating humidity: 0-90% (non-condensing)
Non-operating temperature: -40°C to 85°C
Non-operating humidity: 0%-95% (non-condensing)
Use wide temperature range memory and storage
Vibration During Operation Operation: IEC 60068-2-64, 1 Grms, random, 5 ~ 500 Hz, 1 hr / Per Axis, With SSD/M.2 2280 & Without Graphics Cards
Non-operation: IEC 60068-2-6, 2 G, Sine, 10 ~ 500 Hz, 1 Oct/min, 1 hr / Per Axis
Shock During Operation Operation: IEC 60068-2-27, 50 G, half sine, 11 ms duration, With SSD
Packaging Content For Main system : 9BQJH310AMR-SI
Carton size: 351 x 300 x 166 (mm)
Packing Capacity: 1pc
Terminal Blocks Male Plug x 1 (P/N: 25IO0-2ESDV0-D2R)
Screw M3x4L x 12 (P/N : 25984G-1C014-S00)

For Expansion slot kit : 6BQJH310BPR-SI
Carton size: 460 x 315 x 279 (mm)
Packing Capacity: 1pc
Power Cable #18 350mm x 2 (P/N: 25CRI-35030I-S9R)
Screw #6-32x4L x16 (P/N: 25KS2-13004F-S0R)
Order Information System : 9BQJH310AMR-SI & 6BQJH310BPR-SI

(Built in Components: Please contact with your sales representative for more information or e-mailed to :
Optional Kit TPM 2.0 module P/N: 9CTM000NR-00