QBiP-8665A
3.5” SubCompact Board with 8th Generation Intel® Core™ i7-8665UE Processor, Dual Channel DDR4 memory, 4 x COM, 2 x SATA 6Gb/s, 4 x USB 3.2 Gen 2x1, 2 x USB 2.0
Key Features
  • 3.5’’ SBC
  • Intel® Core™ i7-8665UE Processor
  • Dual Channel DDR4, 2 x SO-DIMMs
  • 2 x GbE LAN Ports
  • 2 x SATA 6Gb/s Ports
  • Ultra-Fast M.2 with PCIe Gen3 x4 interface
  • 2 x HDMI, LVDS ports for multiple display
  • 1 x COM Port (RS-232/422/485 & RI/5V/12V)
  • 3 x COM Ports (RS-232)
  • 4 x USB 3.2 Gen 2x1

3.5 " SubCompact Board with 8th Generation Intel® Core™ i7-8665UE Processor, Dual Channel DDR4 memory, 4 x COM, 2 x SATA 6 Gb/s, 4 x USB 3.2 Gen 2x1, 2 x USB 2.0

Specification
Form Factor 3.5" SBC
146W x 101.7D(mm)
CPU Intel® Core™ i7-8665UE Processor
14nm, 4 cores, 8 threads, up to 4.40 GHz
vPro support, TDP 15W
8 MB Smart Cache
Socket 1 x FCBGA1528
Memory 2 x DDR4 SO-DIMM sockets, Max. Capacity 64 GB
Support Dual Channel DDR4 2400 MHz memory modules
Ethernet 2 x GbE LAN Ports (Intel® I219LM and Intel® I211AT)
Video Integrated Graphics Processor - Intel® UHD Graphics 620:
2 x HDMI 1.4 ports, supporting a maximum resolution of 4096x2304 @24Hz
1 x LVDS port, supporting a maximum resolution of 1920x1080 @60Hz

(3 independent display outputs)
Audio Realtek® Audio Codec
Storage 2 x SATA 6Gb/s Ports (SATA RAID 0/1/5)
Expansion Slots 1 x 2280 M.2 M-Key (PCIe x4, SATA 6Gb/s)
1 x 2230 M.2 E-Key
1 x Full-size Mini PCIe with SIM slot (PCIe x1 + USB2.0) -- support 3G/4G module
Internal I/O 1 x 4-pin box power connector (DC in +9V~36VDC) (+48VDC for Optional)
2 x SATA Power headers
1 x CPU fan header
1 x System fan header
1 x Front panel header
1 x Front panel audio header
1 x 2W Speaker out header
2 x USB 2.0 headers
3 x COM headers (RS-232)
1 x Backlight Control header
1 x AT/ATX mode select jumper
1 x GPIO (8-bits) & SMBUS header
Rear I/O 1 x COM Port (RS-232/422/485 & RI/5V/12V)
2 x HDMI
2 x RJ45 LAN Ports
4 x USB 3.2 Gen 2x1
TPM 1 x TPM header
OS Compatibility Windows 10 (x64)
Operating Properties Operating temperature: 0°C to +60°C
Operating humidity: 0-90% (non-condensing)
Non-operating temperature: -40°C to +85°C
Non-operating humidity: 0%-95% (non-condensing)
Packing Content Carton size: 465 x 351 x 217 (mm)
Packing Capacity: 10pcs

Single Box size: 221 x 178 x 65 (mm)
Single Box weight: Approx. 0.4kg

Including:
SATA power Cable x 1 (P/N: 25CRI-200B02-K1R)
Order Information 9MWHLUDSMR-SI (Box Packing)
Optional Kit Fanless Heatsink P/N: 25ST1-153108-A7R
Fansink P/N: 25ST4-113100-A7R
Heat spreader P/N: 25ST5-8265A0-A8R
TPM 2.0 module P/N: 9CTM000NR-00
TPM Cable P/N: 25CRZ-100600-S9R
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