Thin Mini-ITX with Intel® H110 Chipset and support of 7th/6th Generation Intel® Core™ Processors, Dual channel DDR4 memory, 1 x COM, 9 x USB, 2 x SATA 6Gb/s
Key Features
  • Thin Mini-ITX form factor
  • Supports 7th / 6th Generation Intel® Core™ Processors
  • Intel® H110 Express Chipset
  • Dual Channel DDR4, 2 x SO-DIMMs
  • 1 x GbE LAN port
  • 2 x SATA 6Gb/s ports
  • HDMI, Display Port, LVDS ports for multiple display
  • 1 x RS232 COM port

Thin Mini-ITX with 7th/6th Generation Intel® Core™ Processor, Dual channel DDR4 memory, 1 x COM , 9 x USB, 2 x  SATA 6Gb/s

Form Factor Thin Mini-ITX
170W x 170D(mm)
CPU Support for 7th/6th Generation
Intel® Core™ i7/i5/i3 processors, Pentium® & Celeron® processors in the LGA1151 package
TDP under 65W
L3 cache varies with CPU
Socket 1 x LGA 1151
Chipset Intel® H110 Express Chipset
Memory 2 x DDR4 SO-DIMM sockets, Max. Capacity 32GB
Support Dual channel DDR4 2400/2133 MHz memory modules
Ethernet 1 x GbE LAN port (Realtek® RTL8111HS)
Video Integrated Graphics Processor - Intel® HD Graphics support:
1 x HDMI 1.4 port, supporting a maximum resolution of 4096x2160 @30Hz
1 x DP port, supporting a maximum resolution of 4096x2160 @60Hz
1 x LVDS port, supporting a maximum resolution of 1920x1080 @60Hz

(2 independent display outputs)
Audio Realtek® Audio Codec
Storage 2 x SATA 6Gb/s ports
Expansion Slots 1 x 2280/2260 M.2 M-Key (PCIe x2, SATA 6Gb/s)
1 x 2230 M.2 E-Key
Internal I/O 1 x 2-pin ATX main power connector
1 x SATA Power connector
1 x CPU fan header
1 x System fan header
1 x Front panel header
1 x Front panel audio header
1 x 3W Speaker out header
1 x DMIC header
5 x USB 2.0 headers
1 x COM Header (RS-232)
1 x FPD (For LVDS 19V)
1 x FPD_SW 1x3 (For Panel Power SW)
1 x LCD_VCC Pin header
1 x Back Light Control header
Rear I/O 2 x Audio jacks (Line out, Mic in)
1 x HDMI
1 x Display Port
1 x RJ45 LAN port
4 x USB 3.0
1 x DC Jack (+12V/+19VDC)
TPM 1 x TPM Header
OS Compatibility Windows 10 (x64)
Operating Properties Operating temperature: 0°C to 60°C
Operating humidity: 0-90% (non-condensing)
Non-operating temperature: -20°C to 70°C
Non-operating humidity: 0%-95% (non-condensing)
Packing Content Capacity: 20pcs
Carton size: 550 x 451 x 330(mm)
IO Shield x 1 (P/N: 12AIO-H77TN3-00R)
IO Shield STD x 1 (P/N: 12AIO-H77TN4-00R)
SCREW FLAT HEAD M2*2.5 GTY x 1 (P/N: 12KS2-110202-01R)
SCREW M3x3L D=5 FLAT HEAT ST x 1 (P/N: 25982G-1C024-S00)
SATA Power cable x 1 (P/N: 25CRI-270320-D3R)
Order information 9MDH11KINR-SI (Bulk Packing)
Optional Kit TPM 2.0 module: 9CTM000NR-00
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