Industrial system with Intel® H310 Chipset, support for Intel® 9th/8th Gen Processors and Discrete GFX card
Key Features
  • System Size : 224W x 343D x 146H(mm) - Discrete GFX card support (optional)
  • Support Intel® 9th/8th Gen Processor
  • Dual Channel DDR4, 2 x SO-DIMMs
  • DVI-D, VGA & DP ports for multiple display
  • 4 x GbE LAN Ports
  • 4 x COM Ports
  • 8 x USB Ports
  • Factory Automation
  • Transportation
  • Embedded & Industrial Applications
  • Machine Vision

QBiX-JMB-CFLA310HG-A1, an integration system of QBiX-JMB-CFLA310H-A1 and expansion kit, is mainly designed for more powerful image processing application, including Artificial Intelligence (AI), Machine Learning (ML), machine vision, object recognition, surveillance & industrial application in factory, logistics and even healthcare systems, to increase production efficiency.  It is a high-performance fanless embedded computer featured with Intel® H310 Express Chipset and supported by Intel® 9th/8th gen Core™ i processor in LGA1151 package, to provide powerful computing and excellent graphic performance.  

The expansion kit includes 1 x PCIe x16 (Gen3) and 1 x PCIe x1 (Gen 3) to support discrete GFX card up to 250W. 

In addition, it offers 1 x Display Port, 1 x DVI-D Port and 1 x VGA Port for two independent display outputs, rich I/O interface of 4 x USB 3.2 Gen 1, 4 x USB 2.0, 2 x switchable COM ports (RS-232/422/485 & RI/5V/12V), 2 x RS232 COM ports, 4 GbE LAN ports and expansion M.2 slots to connect multiple devices and implement industrial applications.  This system supports full range 12-48V DC power inputs for operating temperature of -20°C~50°C .   The system supports 2.5" HDD/SSD (SATA 6Gb/s) with vibration resistance of 3 Grms/5~500Hz and shock endurance to 50G/11ms, to meet industrial standard.

                                QBiX-JMB-CFLA310H-A1                                                                                                QBiX-JMB-CFLA310HG-A1 


224W x 343D x 146H(mm) - Discrete GFX max 250W support (Optional)


Support for 9th/8th Generation

Intel® Core™ i7/i5/i3, Pentium® and Celeron® processors in the LGA1151 package

TDP under 65W


Intel® H310 Express Chipset


2 x DDR4 SO-DIMM sockets, Max. Capacity 32 GB

Support Dual channel DDR4 2666/2400 MHz memory modules


1 x GbE LAN Port (Intel® I219V)

3 x GbE LAN Ports (Intel® I211AT)

Graphic Support

Integrated Graphics Processor - Intel® HD Graphics support:

1 x DP port, supporting a maximum resolution of 4096x2160 @30Hz

1 x DVI-D port, supporting a maximum resolution of 1920x1080 @60Hz

1 x VGA port, supporting a maximum resolution of 1920x1200 @60Hz

(2 independent display outputs)


Realtek® Audio Codec


3 x 2.5" HDD/SSD (SATA 6Gb/s)

Expansion Slots

1 x 2280 M.2 M-Key (SATA 6Gb/s)

1 x 2230 M.2 E-Key (WiFi/BT)

1 x Full-size Mini PCIe with SIM slot (PCIe x1 + USB2.0) -- support 3G/4G module

1 x PCIe slot -- Discrete riser card support

Front I/O

1 x Power Switch/Power/HDD LED

3 x Audio Jacks (Line in, Line out, Mic in)

1 x Display port

1 x DVI-D

1 x VGA

2 x COM Ports (RS-232/422/485 & RI/5V/12V)

2 x COM Ports (RS-232)

4 x RJ45 LAN Ports

4 x USB 3.2 Gen 1

4 x USB 2.0

1 x 4-pin Terminal Block

2 x External Antenna Holes (Optional)

Rear I/O


Riser card (Optional)

PCIe x4 (Gen3 x1)

PCIe x16 (Gen3 x16) -- Discrete GFX card: max. 250W, max length 293mm


+24V~48VDC (Full Range) -- Support discrete GFX card

Operation Temperature For Main system :
Operating temperature: -20°C to 50°C (CPU TDP 65W)
Operating temperature: -20°C to 60°C (CPU TDP 35W)

For Full system :
Depends on the Graphic cards installed in the system

Operating humidity: 0-90% (non-condensing)

Non-operating temperature: -40°C to 85°C

Non-operating humidity: 0%-95% (non-condensing)

Use wide temperature range memory and storage

Vibration During Operation

Operation: IEC 60068-2-64, 3 Grms, random, 5 ~ 500 Hz, 1 hr / Per Axis, With SSD/M.2 2280

Non-operation: IEC 60068-2-6, 2 G, Sine, 10 ~ 500 Hz, 1 Oct/min, 1 hr / Per Axis

Shock During Operation

Operation: IEC 60068-2-27, 50 G, half sine, 11 ms duration, With SSD

Packaging Content Carton size: 460 x 315 x 279 (mm)
Packing Capacity: 1pc

Power Cable #20 350mm x 1 (P/N: 25CRI-350902-H3R)
Screw M3x4L x 12 (P/N: 25984G-1C014-S00)
Screw M3x5L x 8 (P/N: 25983G-1C011-S00)
Screw #6-32x5L x 3 (P/N: 2598EG-1C002-S00)
Terminal Blocks Male Plug x 1 (P/N: 25IO0-2ESDV0-D2R )
Order Information

System : 9BQJH310AMR-SI & 6BQJH310APR-SI

(Built in Components: Please contact with your sales representative for more information
or e-mailed to : sales@gigaipc.com)
Optional Kit

TPM 2.0 module P/N: 9CTM000NR-00

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