QBiP-1115G4EBT
3.5” SubCompact Wide Temperature Board with 11th Generation Intel® Core™ i3-1115G4E Processor, Dual Channel DDR4 memory, 4 x COM, 1 x SATA 6Gb/s, 4 x USB 3.2 Gen 2x1, 4 x USB 2.0
Key Features
  • 3.5’’ SBC
  • Intel® Core™ i3-1115G4E Processor
  • Dual Channel DDR4, 2 x SO-DIMMs
  • 2 x GbE LAN Ports
  • 1 x SATA 6Gb/s Port
  • Ultra-Fast M.2 with PCIe Gen3 x2 interface
  • 2 x HDMI, LVDS ports for multiple display
  • 1 x COM Port (RS-232/422/485 & RI/5V/12V)
  • 3 x COM Ports (RS-232/422/485)
  • 4 x USB 3.2 Gen 2x1
  • Wide Temperature Embedded Motherboard

3.5” SubCompact Wide Temperature Embedded Motherboard with 11th Generation Intel® Core™ i3-1115G4E Processor, Dual Channel DDR4 memory, 4 x COM, 1 x SATA 6Gb/s, 4 x USB 3.2 Gen 2x1, 4 x USB 2.0

Specification
Form Factor 3.5" SBC
146W x 101.7D(mm)
CPU Intel® Core™ i3-1115G4E Processor
10nm SuperFin, 2 cores, 4 threads, up to 3.90 GHz
TDP 28W
6 MB Smart Cache
Socket 1 x FCBGA1449
Memory 2 x DDR4 SO-DIMM sockets, Max. Capacity 64 GB
Support Dual Channel DDR4 3200 MHz memory modules
Ethernet 2 x GbE LAN Ports (Intel® I219V and Intel® I211AT)
Video Integrated Graphics Processor - Intel® UHD Graphics:
2 x HDMI 2.0 ports, supporting a maximum resolution of 4096x2160 @60Hz
1 x LVDS port, supporting a maximum resolution of 1920x1200 @60Hz

(3 independent display outputs)
Audio Realtek® Audio Codec
Storage 1 x SATA 6Gb/s Port (SATA RAID 0/1)
Expansion Slots 1 x 2280 M.2 M-Key (PCIe x2, SATA 6Gb/s)
1 x 2230 M.2 E-Key
1 x Full-size Mini PCIe with SIM slot
1 x PCIe x1 (Board to Wire connector, PCIe Gen3 x1)
Internal I/O 1 x 4-pin box power connector (DC in +9V~48VDC)
1 x SATA Power header
1 x CPU fan header
1 x System fan header
1 x Front panel header
1 x Front panel audio header
1 x 2W Speaker out header
4 x USB 2.0 headers
3 x COM headers (RS-232/422/485)
1 x Backlight Control header
1 x AT/ATX mode select jumper
1 x GPIO (8-bits) & SMBus header
1 x SPI header
Rear I/O 1 x COM Port (RS-232/422/485 & RI/5V/12V)
2 x HDMI
2 x RJ45 LAN Ports
4 x USB 3.2 Gen 2x1
TPM 1 x TPM header
OS Compatibility Windows 10/11 (x64)
Operating Properties Operating temperature: -20°C to 70°C
Operating humidity: 0-90% (non-condensing)
Non-operating temperature: -40°C to 85°C
Non-operating humidity: 0%-95% (non-condensing)
Packing Content Carton size: 375 x 324 x 293 (mm)
Packing Capacity: 10pcs

Single Box size: 256 x 175 x 59 (mm)

Including:
SATA power Cable x 1 (P/N: 25CRI-200B02-K1R)
Fanless Heatsink x 1 (P/N: 25ST1-1Z3101-AFR)
Order Information 9MTGU3BSMR-SI1 (Box Packing)
Optional Kit TPM 2.0 module P/N: 9CTM010NR-00
TPM Cable P/N: 25CRZ-100600-S9R
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