Industrial system with Intel® H310 Chipset, support of Intel® 9th/8th Gen Processors and Discrete GFX support
Key Features
  • System Size : 224W x 343D x 146H(mm) - Discrete GFX support (optional)
  • Intel® 9th/8th Gen Processor, max TDP 65W
  • Dual Channel DDR4, 2 x SO-DIMMs
  • DVI-D, VGA & DP ports for multiple display
  • 4 x GbE LAN ports
  • 4 x COM Ports
  • 8 x USB Ports
  • Factory Automation
  • Transportation
  • Embedded & Industrial Applications
  • Machine Vision

QBiX-JMB-CFLA310HG-A1, an integration system of QBiX-JMB-CFLA310H-A1 and expansion kit, is mainly designed for more powerful image processing application, including Artificial Intelligence (AI), Machine Learning (ML), machine vision, object recognition, surveillance & industrial application in factory, logistics and even healthcare systems, to increase production efficiency.  It is a high-performance fanless embedded computer featured with Intel® H310 Express Chipset and supported by Intel® 8th/9th gen Core™ i processor in LGA1151 package, to provide powerful computing and excellent graphic performance.  

The expansion kit includes 1 x PCIe x16 (Gen3) and 1 x PCIe x1 (Gen 3) to support discrete GFX card up to 250W. 

In addition, it offers 1 x Display Port, 1 x DVI-D port and 1 x VGA port for two independent display outputs, rich I/O interface of 4 x USB 3.0/2.0, 2 x switchable COM ports (RS-232/422/485 & RI/5V/12V), 2 x RS232 COM ports, 4 GbE LAN ports and expantion M.2 slots to connect multiple devices and implement industrial applications.  This system supports full range 12-48V DC power inputs for operating temperature of -20°C~50°C .   The system supports 2.5" HDD/SSD (SATA 6Gb/s) with vibration resistance of 3 Grms/5~500Hz and shock endurance to 50G/11ms, to meet industrial standard.

                                QBiX-JMB-CFLA310H-A1                                                                                                QBiX-JMB-CFLA310HG-A1 

Dimension 224W x 343D x 146H(mm) - Discrete GFX max 250W support (optional)
CPU Support for 9/8th Generation
Intel® Core™ i7/i5/i3, Pentium® and Celeron® processors in the LGA1151 package
TDP under 65W
Chipset Intel® H310 Express Chipset
Memory 2 x DDR4 SO-DIMM sockets, Max. Capacity 32GB
Support Dual channel DDR4 2644/2400 MHz memory modules
Ethernet 1 x GbE LAN port (Intel® i219V)
3 x GbE LAN ports (Intel® i211AT)
Graphic support Integrated Graphics Processor - Intel® HD Graphics support:
1 x DP port, supporting a maximum resolution of 4096x2160 @30Hz
1 x DVI-D port, supporting a maximum resolution of 1920x1080 @60Hz
1 x VGA port, supporting a maximum resolution of 1920x1200 @60Hz

(2 independent display outputs)
Audio Realtek® ALC269 with 2W amplifer
High Definition Audio
Storage 3 x 2.5" HDD/SSD (SATA 6Gb/s)
Expansion Slots 1 x 2280 M.2 M-Key (SATA 6Gb/s)
1 x 2230 M.2 E-Key (WiFi/BT)
1 x Full-size Mini PCIe with SIM slot (PCIe x1 + USB2.0) -- support 3G/4G module
1 x PCIe slot -- Discrete riser card support
Front I/O 1 x Power Switch/Power/HDD LED
3 x Audio jacks (Line in, Line out, Mic in)
1 x Display port
1 x DVI-D
1 x VGA
2 x COM (RS-232/422/485 and RI/5V/12V)
2 x COM (RS-232)
4 x RJ45 LAN ports
4 x USB 3.0
4 x USB 2.0
1 x 4 pin Terminal Block
2 x External Antenna (optional)
Riser card (optional) PCIe x4 (Gen3 x1)
PCIe x16 (Gen3 x16) -- Discrete GFX card: max. 250W, max length 293mm
Rear I/O --
Power +24V~36VDC (full Range) -- Support discrete GFX card
Operation temperature Operating temperature: -20°C to 60°C (CPU TDP 35W, Add external GFX card Kits)
Operating humidity: 0-90% (non-condensing)
Non-operating temperature: -40°C to 85°C
Non-operating humidity: 0%-95% (non-condensing)
Use wide temperature range memory and storage
Vibration During Operation Operation: IEC 60068-2-64, 3 Grms, random, 5 ~ 500 Hz, 1 hr / Per Axis, With SSD/M.2 2280
Non-operation: IEC 60068-2-6, 2 G, Sine, 10 ~ 500 Hz, 1 Oct/min, 1 hr / Per Axis
Shock During Operation Operation: IEC 60068-2-27, 50 G, half sine, 11 ms duration, With SSD
Packaging Content Box Packing Capacity: 1
Carton size: 460x315x279(mm)
CABLE POWER #20 350mm x 1 (P/N: 25CRI-350902-H3R)
SCREW M3x4L x 12 (P/N: 25984G-1C014-S00)
SCREW M3x5L x 8 (P/N: 25983G-1C011-S00)
SCREW #6-32x5L x 3 (P/N: 2598EG-1C002-S00)
Order Information System : 9BQJH310AMR-SI & 6BQJH310APR-SI
(Built in : CPU i3-9100E / DDR4 8GB)
Optional kit TPM 2.0 module P/N: 9CTM000NR-00
Tracking list