Industrial system with Intel® H310 Chipset, support for Intel® 9th/8th Gen Processor / Display Port/ DVI-D port/ VGA port/ USB 3.0/ USB 2.0/COM ports /4 GbE LAN ports /M.2 slots
Key Features
  • System Size : 224W x 257D x 77H (mm)
  • Intel® 9th/8th Gen Processor, TDP 65W
  • Dual Channel DDR4, 2 x SO-DIMMs
  • DVI-D, VGA & DP ports for multiple display
  • 4 x GbE LAN ports
  • 4 x COM ports
  • 8 x USB ports
  • Factory Automation
  • Transportation
  • Machine Vision

QBiX-JMB-CFLA310H-A1 is a high-performance fanless embedded computer featured with Intel® H310 Express Chipset and supported Intel® 8th/9th gen Core™ i processor in LGA1151 package, to provide powerful computing and excellent graphic performance.  It's mainly designed for edge computing applications, machine vision, robotic image detection, machine automation, surveillance system in factory, logistics and even healthcare systems, to increase production efficiency.

In addition, it offers 1 x Display Port, 1 x DVI-D port and 1 x VGA port for two independent display outputs, rich I/O interface of 4 x USB 3.0/2.0, 2 x switchable COM ports (RS-232/422/485 & RI/5V/12V), 2 x RS232 COM ports, 4 GbE LAN ports and expantion M.2 slots to connect multiple devices and implement industrial applications.  This system supports full range 12-48V DC power inputs for operating temperature of -20°C~50°C .   The system supports 2.5" HDD/SSD (SATA 6Gb/s) with vibration resistance of 3 Grms/5~500Hz and shock endurance to 50G/11ms, to meet industrial standard. 

With an optional riser card support, GIGAIPC offers another Machine Vision Solution : QBiX-JMB-CFLA310HG-A1, the integration system of QBiX-JMB-CFLA310H-A1 and discrete GFX card.

                             QBiX-JMB-CFLA310H-A1                                                                                                QBiX-JMB-CFLA310HG-A1 

Dimension 224W x 257D x 77H(mm)
CPU Support for 9/8th Generation
Intel® Core™ i7/i5/i3, Pentium® and Celeron® processors in the LGA1151 package
TDP under 65W
Chipset Intel® H310 Express Chipset
Memory 2 x DDR4 SO-DIMM sockets, Max. Capacity 32GB
Support Dual channel DDR4 2644/2400 MHz memory modules
Ethernet 1 x GbE LAN port (Intel® i219V)
3 x GbE LAN ports (Intel® i211AT)
Graphic Support Integrated Graphics Processor - Intel® HD Graphics support:
1 x DP port, supporting a maximum resolution of 4096x2160 @30Hz
1 x DVI-D port, supporting a maximum resolution of 1920x1080 @60Hz
1 x VGA port, supporting a maximum resolution of 1920x1200 @60Hz

(2 independent display outputs)
Audio Realtek® Audio Codec
Storage 3 x 2.5" HDD/SSD (SATA 6Gb/s)
Expansion Slots 1 x 2280 M.2 M-Key (SATA 6Gb/s)
1 x 2230 M.2 E-Key (WiFi/BT)
1 x Full-size Mini PCIe with SIM slot (PCIe x1 + USB2.0) -- support 3G/4G module
1 x PCIe slot -- Discrete riser card support
Front I/O 1 x Power Switch/Power/HDD LED
3 x Audio jacks (Line in, Line out, Mic in)
1 x Display port
1 x DVI-D
1 x VGA
2 x COM (RS-232/422/485 and RI/5V/12V)
2 x COM (RS-232)
4 x RJ45 LAN ports
4 x USB 3.0
4 x USB 2.0
1 x 4 pin Terminal Block
2 x External Antenna (optional)
Rear I/O --
Power +12V~48VDC (Full Range)
Operation temperature Operating temperature: -20°C to 50°C (CPU 65W TDP)
Operating temperature: -20°C to 60°C (CPU 35W TDP)
Operating humidity: 0-90% (non-condensing)
Non-operating temperature: -40°C to 85°C
Non-operating humidity: 0%-95% (non-condensing)
Use wide temperature range memory and storage
Vibration During Operation Operation: IEC 60068-2-64, 3 Grms, random, 5 ~ 500 Hz, 1 hr / Per Axis, With SSD/M.2 2280
Non-operation: IEC 60068-2-6, 2 G, Sine, 10 ~ 500 Hz, 1 Oct/min, 1 hr / Per Axis
Shock During Operation Operation: IEC 60068-2-27, 50 G, half sine, 11 ms duration, With SSD
Packaging Content Box Packing Capacity: 1
Carton size: 300x351x166(mm)
SCREW M3x4L x 12 (P/N: 25984G-1C014-S00)
Order Information 9BQJH310AMR-SI (Box packing)
(Built in : CPU i3-9100E / DDR4 8GB)
Optional Kit TPM 2.0 module P/N: 9CTM000NR-00
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